JPH0519316B2 - - Google Patents
Info
- Publication number
- JPH0519316B2 JPH0519316B2 JP59243541A JP24354184A JPH0519316B2 JP H0519316 B2 JPH0519316 B2 JP H0519316B2 JP 59243541 A JP59243541 A JP 59243541A JP 24354184 A JP24354184 A JP 24354184A JP H0519316 B2 JPH0519316 B2 JP H0519316B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- voltage
- plane
- integrated circuit
- voltage distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Power Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58861084A | 1984-03-12 | 1984-03-12 | |
US588610 | 1984-03-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60195993A JPS60195993A (ja) | 1985-10-04 |
JPH0519316B2 true JPH0519316B2 (en]) | 1993-03-16 |
Family
ID=24354574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59243541A Granted JPS60195993A (ja) | 1984-03-12 | 1984-11-20 | 電力供給装置 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0154765B1 (en]) |
JP (1) | JPS60195993A (en]) |
DE (1) | DE3585924D1 (en]) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4685032A (en) * | 1985-07-01 | 1987-08-04 | Honeywell Information Systems Inc. | Integrated backplane |
FR2611412B1 (fr) * | 1987-02-26 | 1996-08-14 | Nec Corp | Carte stratifiee d'interconnexion |
DE9304011U1 (de) * | 1993-03-18 | 1993-07-15 | Reiter, Hubert, 8011 Hohenbrunn | Peripherie-Anschlußsystem für PC |
JPH0828244B2 (ja) * | 1993-04-28 | 1996-03-21 | 日本電気株式会社 | マルチチップパッケージの給電構造 |
DE9404263U1 (de) * | 1994-03-14 | 1994-05-11 | Siemens Nixdorf Inf Syst | Stromschienenkopplung |
JPH07263824A (ja) * | 1994-03-18 | 1995-10-13 | Nec Corp | 配線基板 |
EP1102316A1 (de) * | 1999-11-16 | 2001-05-23 | Infineon Technologies AG | Multi-Chip IC-Karte mit Bus-Struktur |
CN117673061B (zh) * | 2023-11-30 | 2024-05-17 | 海信家电集团股份有限公司 | 智能功率模块和电子设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3519959A (en) * | 1966-03-24 | 1970-07-07 | Burroughs Corp | Integral electrical power distribution network and component mounting plane |
DE1790126B1 (de) * | 1968-09-14 | 1972-05-31 | Metrawatt Gmbh | Elektrisches Geraet |
US4315315A (en) * | 1971-03-09 | 1982-02-09 | The Johns Hopkins University | Graphical automatic programming |
JPS5533670Y2 (en]) * | 1975-06-24 | 1980-08-09 | ||
JPS5739557A (en) * | 1980-08-21 | 1982-03-04 | Mitsubishi Electric Corp | Semiconductor device |
JPS58178547A (ja) * | 1982-04-12 | 1983-10-19 | Matsushita Electric Ind Co Ltd | 電気部品組立体およびその製造方法 |
-
1984
- 1984-11-20 JP JP59243541A patent/JPS60195993A/ja active Granted
-
1985
- 1985-01-02 DE DE8585100003T patent/DE3585924D1/de not_active Expired - Lifetime
- 1985-01-02 EP EP19850100003 patent/EP0154765B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS60195993A (ja) | 1985-10-04 |
EP0154765A2 (en) | 1985-09-18 |
DE3585924D1 (de) | 1992-06-04 |
EP0154765B1 (en) | 1992-04-29 |
EP0154765A3 (en) | 1988-08-17 |
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